报告
1
：
Perspectives and Overview of Korean LED Technologies and Market
报告
2
：
Th
ermal modeling, analysis, and design of high power LED packages and systems
报告人：
Moo Whan Shin
Chair/
Professor
,
Department of Materials Science and Engineering
Myong Ji University
时间：2010年7月6日下午
地点：上海大学延长校区平板显示中心会议室
Prof. Moo Whan Shin is one of world-wide well known leaders in thermal analysis and design of high power LEDs. In 1991, he received Ph.D in Materials Science and Engineering from the North Carolina State University, USA. in 1995, he joined as a faculty of Myong Ji University in the Department of Materials Science and Engineering, where he is currently a Professor. He was involved in more than 25 invited/plenary talks on the subject of thermal packages of LEDs and high temperature devices at academic societies including the national Academy of Science, USA, and ECTC. His efforts have been extended to several educational programs for industries; invited lectures from the Industry Times, Japan and EMDEC of KAIST, Korea. Prof. Shin attributed to the development and application of transient thermal analysis of LEDs as an advisory scholar for MicRed, Hungary, in 2002. Since 2004, he worked for the Seoul Semiconductor Company for two years as a Technical Consultant in an area of thermal packaging of LEDs. He holds 20 patents and published more than 185 papers at international journals and conferences. He served as a Co-Chair of the International Green Lighting & Display Seminar and Forum, 2009. He was a Co-Chair of the International LED Seminar & Forum, 2008. He was a General Chair of the International Seminar on LED, Display, and Lighting 2007. Prof. Shin is a vice chairman of the green growth sub-committee of the Future Science/Technology Forum of the Korean National Assembly. He is currently a technical advisory member of the Korean LED Association, organizing committee member of THERMINICS, EU and THETA2. He has authored/co-authored three books, one of which is “Introduction to LED packaging technology” His research areas are thermal modeling, analysis, and design of high power LED packages and systems.
